職位描述
崗位職責(zé)：
Manufacturing
Manage process change, ECO validation/implementation, defines technical requirements, procedures and WI.
Transfer knowledge from the project team. Training of operators/technicians on the product and process.
Participates in establishing production equipment specification and improvements.
Participate in process control plan design and execution.
Quality
Troubleshoots production line issues related to yield, quality and throughput.
Constructs and executes DOE, SPC/CPk to address yield and quality issues and implement solution in production environment to meet production goals.
Productivity
Conduct feasibility studies and testing on new or modified designs.
Conducts controlled process optimization experiments, analyze process test results, issue report and make technical recommendation.
任職要求：
At least 5+ years related experience in Die Bond product/process engineering.
Proficient in few or more skills in SMT, die attach, wire bonding, bumping, under fill, coating, sub-system assembly, cleaning, etc.
Problem investigation and corrective implementation capability.
Good documentation skills and ability to write procedures and training manual.
Able to apply Statistical Process Control knowledge and DOE techniques.
Able to analyze data, attention to detail and make logical and rational conclusion.
Desirable
Semiconductor industries or related manufacturing knowledge is highly desirable.
Ability to work under pressure and independently to meet timeline.
